Memory packaging market was valued at USD 35.9 billion in 2017 and is expected to reach USD 47.3 billion by 2023 registering a CAGR of 4.7%, during the forecast period 2018 – 2023.
The scope of the report includes the study of memory packaging with respect to platform, application, and end users. Regions considered under the scope of the report include North America, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Various players offering memory packaging solutions in the market are SK Hynix Inc., Micron Technology Inc., ASE Group, and Winbond Electronics Corporation, among others.
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Like processors, memory is made from small semiconductor chips and must be packaged into less fragile and smaller chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, ranging from the low pin-count SOP packages to high pin-count TSV options, depending on product requirements, like performance, density, and cost. One such packaging platform is the wire bond-BGA. Easy changeovers, comprehensible program adjustments, and low engineering costs are driving the demand for wire-bond memory packaging solutions. Even with variations in the package design, the wire-bond memory packaging platform is the most the preferred interconnection platform because of its flexibility, reliability, and low cost. Also, the automotive market, which generally uses low density (low-MB) memory, may observe an increase in the acceptance of DRAM memory, led by the emerging trend of autonomous driving and in-vehicle infotainment. This is expected to fuel the growth of the memory packaging market.
Increase in the Demand for Smartphones
The highest demand for memory can be observed in the smartphones market. On an average, the DRAM memory capacity per smartphone may increase more than threefold to reach around 6GB, by 2022. DRAM cost per smartphone signifies >10% of the bill of materials of the smartphone and is anticipated to increase further. The NAND capacity per smartphone may increase more than fivefold to reach >150GB by 2022. In mobile applications, the focus of memory packaging is expected to be on the wire-bond BGA platform. It may also start to move into the multi-chip package (ePoP) for high-end smartphones.
According to the Consumer Technology Association, in 2013, almost 145 million people in the United States owned a smartphone, and this figure is set to rise to 220 million by 2018. Additionally, the share of smartphones consumers in China was over 53.3% of the total mobile phone users in the country in 2016, which increased to over 56 % in 2017. With the increase in adoption of smartphones, the use of packaged memory chips is also increasing. Also, with the development of memory packaging techniques, the size of smartphones is reduced, which may further augment the demand for the memory packing market.
Asia-Pacific is expected to be the Fastest Growing Region in the Memory Packaging Market
The memory packaging market in the Asia-Pacific region is predicted to witness a rapid growth over the forecast period. China stands as a largest Asia-Pacific memory packaging market, due to a wide range of applications of memory packaging in numerous consumer electronics, mainly tablets and smartphones. The high adoption rate of smartphones in many Asia-Pacific countries is due to the advanced features and sleek aesthetic looks of these smartphones. Memory packaging technologies offer effective space utilization to the smartphones, which is a crucial factor leading to the growth of this market. Also, the existence of significant memory packaging vendors in the region, such as SK Hynix Inc., Samsung Electronics Co. Ltd, Intel Corporation, etc., is boosting the memory packaging market in the region.
Key Developments in the Market
June 2018: Micron Technology Inc. announced a volume production for its 8GB GDDR6 memory. Targeting up to 64GB/s in one package, GDDR6 is set to bring a significant improvement over the fastest available GDDR5. This high level of single-chip performance, using proven and industry-standard BGA packaging is expected to give designers a powerful, cost-efficient, and low-risk solution using the most scalable and high-speed discrete memory available in the market.
Oct 2017: Winbond Electronics Corporation stacked NOR and NAND dies in 8-pin memory package. The company’s new W25M Series allows stacking of homogeneous or heterogeneous flash so that memories of varying densities can be used for the code and data storage.
SK Hynix Inc., Cisco Systems Inc., Nanya Technology Corporation., Winbond Electronics Corporation., Micron Technology Inc., Fujitsu Semiconductor Limited., Western Digital Corporation., Samsung Electronics Co. Ltd., Qualcomm Technologies Inc., STMicroelectronics., IBM Corporation., Dell EMC., Toshiba Electronic Devices & Storage Corporation., Hana Micron Inc., Apple Inc. and ASE Group.
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